Infineon’s ENDOPACK Cell embeds 1,200 V SiC MOSFETs in traction inverter PCBs

Infineon Technologies has introduced ENDOPACK Cell, which embeds its 1,200 V Automotive Gen2p CoolSiC MOSFETs directly in a printed circuit board (PCB). ENDOPACK Cell is designed to help automakers develop traction inverters faster and scale them across vehicle platforms.

ENDOPACK is Infineon’s new brand for chip-embedding technologies in a range of voltage classes, form factors and applications. Infineon uses chip embedding in low-voltage production and is extending it to high-voltage power electronics. The company says ENDOPACK Cell is the industry’s first automotive-qualified, high-voltage chip-embedding solution designed for PCB integration.

ENDOPACK Cell uses standardized PCB design processes and manufacturing infrastructure. Infineon says this enables development cycles up to three times faster than conventional designs. ENDOPACK Cell is also designed to transfer to a design-agnostic production line, allowing design iterations without repeated changes to the manufacturing process.

In ENDOPACK Cell, the power semiconductors are embedded directly in the PCB structure instead of being placed on top of a substrate. Infineon says the architecture reduces inductance to below 2 nH (compared with 20 nH), which enables 30% lower switching losses and approximately 99.5% efficiency under CLTC conditions. According to Infineon, prototype and simulation data indicate peak power density of up to 200 kW/L and a potential 7% improvement in vehicle range.

Chip quantity and placement can be adapted to power requirements and installation space, and geometry is no longer largely determined by a fixed module housing. Multiple cells can be integrated into a single PCB, so the power stage can be configured for the performance and architecture requirements of a specific vehicle platform.

ENDOPACK Cell is ready for mass production. Vehicles using it are planned to enter mass production in 2027.

Source: Infineon Technologies