Hoenle’s Structalit 8205 underfill for automotive power electronics survives 1,000 thermal cycles

Hoenle Adhesives (formerly Panacol) has launched Structalit 8205, a board-level underfill designed for flip chips, BGAs and CSP packages in automotive electronics, power electronics and high-performance computing applications. Underfills mechanically reinforce solder joints by filling the gap beneath packaged components and redistributing thermal stress—critical in automotive applications where power electronics Read more

By jackkellerinc, ago

PositivEnergy to install 435 public EV charging ports in Philadelphia

EV charging infrastructure provider PositivEnergy is expanding its work with the city of Philadelphia to deploy some 435 public DC fast charging and Level 2 charging ports across the city. PositivEnergy offers a Charging-as-a-Service model designed to enable municipalities, enterprises, retailers and commercial property owners to deploy charging infrastructure as Read more

By jackkellerinc, ago
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