Infineon’s new H-DPAK puts a 750 V CoolSiC half-bridge in a top-side-cooled package for EV OBCs and DC-DC converters
Infineon has introduced the H-DPAK, a new package housing an integrated half-bridge built on its 750 V CoolSiC G2 SiC MOSFET technology. The device is designed for power conversion applications in automotive and industrial systems, including single-stage and two-stage on-board chargers, DC-DC converters and EV auxiliaries, as well as HVDC Read more