The transition toward 800V+ architectures, SiC/GaN MOSFETs, and highly integrated power conversion systems (x-in-1) is accelerating, creating new challenges for automotive electronic design.
In this webinar, Francesca Lai and Ann Park will share insights into evolving component design, emerging application requirements, and the role of adhesive solutions in enabling next-generation automotive power electronics components.
What you’ll learn:
- Current market trends reshaping automotive power electronics design
- Emerging material requirements driven by 800V+ architectures, SiC/GaN adoption, and increasing system integration
- How Henkel´s solutions for thermal management, dielectric insulation, and PCB protection ensure long-term reliability in demanding automotive environments.
Join us on Tuesday, 3rd November at 11am EST
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