Para Light Electronics has launched ThermaFlat, a family of SiC MOSFETs in 650 V and 1,200 V ratings built around what the company calls its ultra-low RDS(on) drift technology. In benchmark testing of a 650 V, 21 mΩ TO-247 device, on-resistance changed by roughly 8% as junction temperature swung from -25° C to +125° C, Para Light says. The company describes the 1,200 V parts as carrying a similar temperature coefficient, without giving a figure.

On-resistance in a SiC MOSFET rises as the junction heats, and the effect feeds back on itself. Higher RDS(on) produces more conduction loss, more heat and a higher RDS(on) again. Designers cover that with derating or extra cooling, and both cost power density.

ROHM’s fifth-generation EcoSiC devices take a different approach to the same losses, cutting on-resistance about 30% at 175° C versus its fourth-generation parts.

The ThermaFlat I series covers both voltage classes in industry-standard packages for mainstream converter topologies. ThermaFlat II pairs the same drift technology with a high gate threshold voltage architecture, which the company says improves noise immunity and prevents false turn-on. It runs without a negative gate-off supply, and Para Light expects that to let engineers simplify gate-driver circuitry, cut component count and lower bill-of-materials cost.

SiC MOSFETs are usually held off with a negative gate voltage rather than 0 V, because fast dV/dt at the switching node can couple through the gate-drain capacitance and briefly turn the device back on. Supplying that negative rail adds components to the gate driver. A higher gate threshold voltage raises the margin against the same false turn-on.

Para Light lists AI data center and server power supplies, battery backup and UPS systems, EV charging stations, grid-connected energy storage, photovoltaic inverters, variable frequency drives and industrial automation as applications for the family.

Para Light says it is continuously expanding the portfolio with additional voltage classes, current ratings and package configurations.

Source: Para Light Electronics


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